Osborne 189 series is a one-component room temperature curing thermal silica: 1, one-component, room temperature curing, easy to use, no latches or screws. 2, has a good thermal conductivity, thermal, adhesive properties. 2, neutral curing, curing speed, the vast majority of metals have good adhesion, no corrosion; long-term use will not fall off, no contact with the gap reduced cooling effect; 4, layer has excellent resistance to changes in the level performance, aging resistance, electrical insulation properties and excellent moisture, shock, corona resistant, anti-leakage performance. 5. full compliance with EU ROHS directive. Second, the typical use as a heat transfer medium between the heat sink for the same CPU thermal conductivity, thermal insulation, such as: filling between the CPU and heat sink, thyristor control module and heat sink, high-power components and radiator , adhesive, heat. Third, other information For more detailed product technical data in English (TDS), use of technology, material safety data sheets (MSDS), Environmental Report (SGS), please contact your local sales representative or distributor Osborne.