I. Introduction Osborne series encapsulants can be cured at room temperature or heat curing, the higher the temperature the faster the cure characteristics. The goods in the curing reaction does not produce any by-products that can be applied to the material surface PC, ABS, PVC, etc. and metal class. Its flame retardant UL94-V0 level can be achieved. Full compliance with the EU ROHS directive. Second, the typical use is widely used to heat, flame retardant, high temperature requirements for products such as: automotive electronics, HID, power modules, sensors, circuit boards, transformers, amplifiers. Third, the use of technology 1, measurement:? Accurately weighed component A and B (hardener). Note: Before weighing of glue should be properly stirred to sink to the bottom of the pigments (or fillers) dispersed in glue. 2, mixing: B component will join equipped with A component mixing container. 3, casting: the mix of potting compound to require potting products as soon as possible. 4, curing: good potting parts left at room temperature curing, after beginning to enter the next process solid, need 24 hours to fully cure. Summer temperatures are high, the curing will be faster; low winter temperatures, curing will be slower. Fourth, other information For more detailed product technical data in English (TDS), use of technology, material safety data sheets (MSDS), Environmental Report (SGS), please contact your local sales representative or distributor Osborne.